Howa Sangyo, Shinshu Nagase Co., Ltd. and Idea System Co., Ltd. have developed "TEG Kit for Flip-chip･BGA Mounting Evaluation" together and started selling it on July, 1st, 2000.


Advantages
* This product enables us to do experiments of flip mounting and BGA mounting without initial cost or trouble.
* This product enables us to check the condition of mounting and to measure contact resistance with a check terminal (Quadrupole Measurement)

Type 1. Chip for F/C Mounting 2. Substrate for F/C Mounting 3. Substrate for BGA Mounting

Block-diagram of TEG Kit

Standard Specifications
1. Chip for F/C Mounting --10x10x0.625(mm) with Au Stud Bumps
2. Substrate for F/C Mounting -- 21x21x0.8(mm)
4 Layers double-sided substrate (with respective check terminal)
3.Substrate for BGA Mounting -- 60x60x1.6(mm)

*There are various kinds of options for a bump and cell.
For more detail, please contact us.
inf@houwa-sangyo.co.jp

Shinsyu Nagase Denzai Co., Ltd.
4-1-21 Sinmei-cho Okaya-city Nagano
TEL: +81 266 24 2772 FAX: +81 266 24 3311
URL: http://www.idea-gr.co.jp/

IDEA system Co., Ltd.
4-1-21 Sinmei-cho Okaya-city Nagano
TEL: +81 266 24 2744 FAX: +81 266 24 3311